Item

For the batch

For the prototype

Layer（Maximum)

2-18

20-30

Board material type

FR-4, Ceramic substrate board，Aluminum based board,、High-Tg

PTFE，PPO ，PPE

Rogers,etc,etc

E-65，ect

Compound material lamination

4layer—6layer

6layer—8layer

Maximum dimension

610mm X 1100mm

Dimension tolerance

±0.13mm

±0.10mm

Board thickness coverage

0.2mm--6.00mm

0.20mm--8.00mm

Board thickness tolerance ( t≥0.8mm)

±8%

±5%

Board thickness tolerance(t＜0.8mm)

±10%

±8%

DK thickness

0.076mm--6.00mm

0.076mm--0.100mm

Min line width

0.10mm

0.075mm

Min line space

0.10mm

0.075mm

Out layer copper thickness

8.75um--175um

8.75um--280um

Inner layer copper thickness

17.5um--175um

8.75um--175um

Drilling hole diameter (Mechanical drill)

0.25mm--6.00mm

0.15mm--0.25mm

Finished hole diameter (Mechanical drill)

0.20mm--6.00mm

0.10mm--0.20mm

Hole diameter tolerance4 (Mechanical drill)

0.05mm

Hole position tolerance (Mechanical drill)

0.075mm

0.050mm

Laser drill hole size

0.10mm

0.075mm

Board thickness and hole diameter ratio

10:1

12:1

Solder mask type

GGreen、Yellow、Black、Purple、Blue、White, Red

Minimum Solder Mask Dam

0.10mm

0.075mm

Minimum size of solder mask separation ring

0.05mm

0.025mm

Solder mask oil?plug hole diameter

0.25mm--0.60mm

0.60mm-0.80mm

Impedance control tolerance

±10%

±5%

Surface finish

Hot Air Level、ENIG、Immersion silver、Gold plating, Immersion tin、Gold Finger