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Diversified flexible circuit board
Variety of products:Single-sided board,double-sided board,Flex-rigid printed board,single and double sided board with local reinforcement,multilayer board.
Materials:polyester,polyimide
Thickness of copper conductor:9μm/18μm/35μm/70μm
Technology:gold plating,nickelizing,lead-tin plating,hot-air planing(spray Monthly output:20000M2)
| POlyimide Base Mater |
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| Thickness of copper conductor |
18um(1/2oz) |
35um(1oz) |
50um(1.5oz) |
18um(1/2oz) |
35um(1oz) |
35um(1oz) |
HED |
RA |
HED |
RA |
HED |
RA |
HED |
RA |
HED |
RA |
HED |
RA |
| The thickness of PI Polyimide |
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| 12.5um(1/2mil) |
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√ |
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√ |
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| 25um(1mil) |
√ |
√ |
√ |
√ |
√ |
√ |
√ |
√ |
√ |
√ |
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| 50um(2mil) |
√ |
√ |
√ |
√ |
√ |
√ |
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√ |
√ |
√ |
√ |
| 75um(3mil) |
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√ |
√ |
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| 125um(5mil) |
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√ |
√ |
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| 加强板粘结剂 |
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Subjuct to JIS.IPC-6013 standard
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Pressure sensitive adhesive
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| Reinforcement board |
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0.1/0.2/0.3/0.5/0.6/0.7/0.8/1.0/1.2/1.6 |
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0.5/0.6/0.8/1.0/1.2/1.5/1.6 |
CEM3 |
0.5/0.6/0.8/1.0/1.2/1.6 |
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subjuct to JIS.IPC-6013 standard
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12.5um(1/2mil) 25um(1mil) 50um(2mil) 75um(3mil)
125um(5mil) 175um(7mil) |
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50um(2mil) 75um(3mil) 100um(4mil) 125um(5mil)
190um(7.5mil) 254um(10mil)
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50um(2mil) 75um(3mil) 100um(4mil) 125um(5mil)
190um(7.5mil) 254um(10mil)
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| Cover film |
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12.5um(1/2mil) |
√ |
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25um(1mil) |
√ |
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50um(2mil) |
√ |
√ |
75um(3mil |
√ |
√ |
125um(5mil) |
√ |
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| Technology |
| Laminating cover film |
| solder resisting green oil
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| organic Solderability Preservatives,tin and lead bright plating,nickel and gold plating,chemical nickel and gold
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